| 000 | 00821nam a2200277 i 4500 | ||
|---|---|---|---|
| 003 | BD-DhSUL | ||
| 005 | 20151008033221.0 | ||
| 008 | 151008s1980 nyua 001 0 eng | ||
| 020 | _a0076066002 (pbk.) : | ||
| 020 | _a0070191840 | ||
| 040 |
_aBD-DhSUL _cBD-DhSUL |
||
| 082 | 0 | 0 |
_a621.38173 _222 _bMIC |
| 245 | 0 | 0 |
_aMicroelectronics interconnection and packaging / _cedited by Jerry Lyman. |
| 260 |
_aNew York : _bMcGraw-Hill, _cc1980. |
||
| 300 |
_avii, 320 p. : _bill. ; _c28 cm. |
||
| 365 |
_aBDT. _b500.00 |
||
| 490 | 0 | _aElectronics magazine books | |
| 500 | _aArticles from Electronics magazine. | ||
| 500 | _aIncludes index. | ||
| 526 | _aEEE | ||
| 650 | 0 | _aIntegrated circuits. | |
| 650 | 0 | _aMicroelectronic packaging. | |
| 700 | 1 |
_aLyman, Jerry, _d1926- |
|
| 730 | _aElectronics. | ||
| 942 |
_2ddc _cSID-BK |
||
| 999 |
_c320 _d320 |
||